Impressive hydrophobic TiO₂@Cu mesh for electromagnetic interference shielding Available to Purchase

This study investigated the surface modification of copper mesh using modified titanium dioxide (TiO₂) coatings to enhance its surface hydrophobic properties while preserving electromagnetic interference (EMI) shielding effectiveness. Silicon-coupling-agent-treated titanium dioxide particles were employed to create micro/nanostructured superhydrophobic coatings. The deposition times were found to influence the coating distribution, pore filling and surface hydrophobicity. S-TiO₂@Cu mesh with a single layer of modified titanium dioxide coating exhibited the highest water contact angle compared with T-TiO₂@Cu mesh with triple layer coatings and the original O-TiO₂@Cu mesh. The superior self-cleaning performance and robust wear resistance of the hydrophobic coatings for S-TiO₂@Cu mesh were revealed. In addition, both S-TiO₂@Cu mesh and T-TiO₂@Cu mesh exhibited satisfactory EMI-shielding efficiency without compromising the intrinsic properties of the copper mesh. These findings provide practical insights into surface modification of copper mesh substrates, emphasizing the balance between surface properties and EMI shielding. The hydrophobic coatings hold promise for multifunctional applications, offering enhanced surface properties without compromising EMI-shielding performance.