Illustrative B-Matrix for an electronics company – linkages
| Causal loss description | Origin location (of causal loss) | Resultant: Rework (Solder Defect) at Station #1 | Resultant: Scrap (module Failure - Solder origin) at functional test | Resultant: Warranty claim (module Failure - Solder origin) at customer | Resultant: Scrap (PSU DOA) at incoming inspection | Resultant: High false call rate at AOI station | Resultant: Scrap (component misplacement) at SMT M/C a |
|---|---|---|---|---|---|---|---|
| Inadequate soldering training | QMS/HR (training dept.) | X | X | X | |||
| Poor PSU quality | Supplier X (incoming mat. System) | X | X | X | |||
| Incorrect AOI test parameters | ICT (In-Process control) | X | |||||
| Outdated SMT feeder calibration | SMT M/C A (production) | X | |||||
| Inadequate design review | Engineering dept. | X | X | X | |||
| Poor component kitting | Supplier and incoming system | X |
| Causal loss description | Origin location (of causal loss) | Resultant: Rework (Solder Defect) at Station #1 | Resultant: Scrap (module Failure - Solder origin) at functional test | Resultant: Warranty claim (module Failure - Solder origin) at customer | Resultant: Scrap ( | Resultant: High false call rate at | Resultant: Scrap (component misplacement) at |
|---|---|---|---|---|---|---|---|
| Inadequate soldering training | QMS/HR (training dept.) | X | X | X | |||
| Poor | Supplier X (incoming mat. System) | X | X | X | |||
| Incorrect | X | ||||||
| Outdated | X | ||||||
| Inadequate design review | Engineering dept. | X | X | X | |||
| Poor component kitting | Supplier and incoming system | X |
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