| Design, simulation and modeling | John Gipprich | Northrop Grumman |
| Power and thermal management | Dr. Kinzy Jones | Florida International University |
| Portable wireless and bluetooth | Dr. Fred Barlow | University of Arkansas |
| Broadband | Dr. Jens Mueller | University of Erlangen |
| Fiber optic and electrooptic | Dr. Alan Lyons | Lucent Corp. |
| LTCC | Dr. Mike Lanagan | Penn State University |
| Materials | Dan Amey | DuPont Electronic Technologies |
| Automotive | Dr. D. H. Sarma | Delphi Automotive |
| Integrated passives | Dr. William Borland | DuPont Electronic Technologies |
| Testing and measurement | Mike Janizec | NIST |
| Assembly | Paul Collander | NOKIA |
| Base stations | George Passiopoulos | NOKIA |
| Military | John Roman | Consultant |
| Novel applications | Steve Dai | Motorola |
| Ceramic inteconnect markets | Rick Sigliano | Kyocera Americas |
| Design, simulation and modeling | John Gipprich | Northrop Grumman |
| Power and thermal management | Dr. Kinzy Jones | Florida International University |
| Portable wireless and bluetooth | Dr. Fred Barlow | University of Arkansas |
| Broadband | Dr. Jens Mueller | University of Erlangen |
| Fiber optic and electrooptic | Dr. Alan Lyons | Lucent Corp. |
| LTCC | Dr. Mike Lanagan | Penn State University |
| Materials | Dan Amey | DuPont Electronic Technologies |
| Automotive | Dr. D. H. Sarma | Delphi Automotive |
| Integrated passives | Dr. William Borland | DuPont Electronic Technologies |
| Testing and measurement | Mike Janizec | NIST |
| Assembly | Paul Collander | NOKIA |
| Base stations | George Passiopoulos | NOKIA |
| Military | John Roman | Consultant |
| Novel applications | Steve Dai | Motorola |
| Ceramic inteconnect markets | Rick Sigliano | Kyocera Americas |