Table 2 TIM at paste – results of...

Table 2

TIM at paste – results of adhesion assessment

Substrate	Chip	Pressure	Joint thickness	Adhesion
Cu with Ni/Au	Si with Ti/Au	No	34 µm	4.0 ± 0.9 MPa
Cu with Ni/Au	Si with Ti/Au	1 MPa	30 µm	5.5 ± 2.3 MPa

Substrate	Chip	Pressure	Joint thickness	Adhesion
Cu withNi/Au	Si withTi/Au	No	34 µm	4.0 ± 0.9 MPa
1 MPa	30 µm	5.5 ± 2.3 MPa

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