Table 3 TIM at paste – results of...

Table 3

TIM at paste – results of thermal study

Substrate	Chip	Pressure	Thickness	Thermal interface resistance (TIR) [mm²K/W]
Cu with Ni/Au	Cu with Ni/Au	Soldering SAC alloy	35 µm	7 8
Cu with Ni/Au	Si with Ti/Au	No	60 µm	21 23
Cu with Ni/Au	Si with Ti/Au	1 MPa	30 µm	6 7

Substrate	Chip	Pressure	Thickness	Thermal interface resistance (TIR) [mm²K/W]
Cu with Ni/Au	Cu with Ni/Au	Soldering SAC alloy	35 µm	78
Cu with Ni/Au	Si with Ti/Au	No	60 µm	2123
1 MPa	30 µm	67

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