Table 4 TIM3 paste – results of adhesion...

Table 4

TIM3 paste – results of adhesion assessment

Substrate	Chip	Pressure	Thickness	Adhesion
Cu with Ni/Au	Si with Ti/Au	No	25 µm	2.3 ± 0.5 MPa
Cu with Ni/Au	Si with Ti/Au	2.4 MPa	15 µm	1.9 ± 0.4 MPa

Substrate	Chip	Pressure	Thickness	Adhesion
Cu withNi/Au	Si withTi/Au	No	25 µm	2.3 ± 0.5 MPa
2.4 MPa	15 µm	1.9 ± 0.4 MPa

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