Table 5 TIM3 paste – results of thermal...

Table 5

TIM3 paste – results of thermal study

Substrate	Chip	Pressure	Thermal interface resistance (TIR) [mm²K/W]
Cu with Ni/Au	Si with Ti/Au	No	38 42
Cu with Ni/Au	Si with Ti/Au	2.4 MPa	11 14

Substrate	Chip	Pressure	Thermal interface resistance (TIR)[mm²K/W]
Cu withNi/Au	Si withTi/Au	No	3842
2.4 MPa	1114

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