Table 6 TIM AT2M paste – results of...

Table 6

TIM AT2M paste – results of adhesion assessment

Substrate	Chip	Pressure	Thickness	Adhesion
Cu with Ni/Au	Si with Ti/Au	No	30 µm	11.7 ± 1.7 MPa
Cu with Ni/Au	Si with Ti/Au	2.4 MPa	17 µm	8.5 ± 1.9 MPa

Substrate	Chip	Pressure	Thickness	Adhesion
Cu withNi/Au	Si withTi/Au	No	30 µm	11.7 ± 1.7 MPa
2.4 MPa	17 µm	8.5 ± 1.9 MPa

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