Table 7 TIM AT2M paste – results of...

Table 7

TIM AT2M paste – results of thermal study

Substrate	Chip	Pressure	Thickness	Thermal interface resistance (TIR) [mm²K/W]
Cu with Ni/Au	Si with Ti/Au	No	38 µm	23 24
Cu with Ni/Au	Si with Ti/Au	2.4 MPa	15 µm	5 6

Substrate	Chip	Pressure	Thickness	Thermal interface resistance (TIR)[mm²K/W]
Cu with Ni/Au	Si with Ti/Au	No	38 µm	2324
2.4 MPa	15 µm	56

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