Configuration of FCCSP TV
| Test vehicle feature | Description |
|---|---|
| Die side | |
| Structure | 2 PSV with RDL and UBM |
| min pitch (µm) | 150 |
| RDL stackup | Ti/Cu/plated Cu |
| UBM stackup | Ti/Cu/plated Cu or Ni and SnAg |
| UBM diameter (um) | 85 |
| Substrate side | |
| Structure | FCLGA |
| Package size (mm) | 9.6 × 9.6 |
| Package thickness (mm) | 775 |
| min pitch (um) | 500 |
| Lead size (um) | 260 |
| Test vehicle feature | Description |
|---|---|
| Structure | 2 PSV with RDL and UBM |
| min pitch (µm) | 150 |
| RDL stackup | Ti/Cu/plated Cu |
| UBM stackup | Ti/Cu/plated Cu or Ni and SnAg |
| UBM diameter (um) | 85 |
| Structure | FCLGA |
| Package size (mm) | 9.6 × 9.6 |
| Package thickness (mm) | 775 |
| min pitch (um) | 500 |
| Lead size (um) | 260 |
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