Design of experiment cell of PSV and bump structure
| Leg | Passivation | Bump structure | Remarks |
|---|---|---|---|
| 1 | PI | Ni/SnAg | Standard solder bump |
| 2 | Cu/Ni/SnAg | Standard Cu pillar | |
| 3 | Cu/SnAg | Ni-free pillar | |
| 4 | PBO | Ni/SnAg | Plated solder bump with PBO |
| 5 | Cu/Ni/SnAg | Cu pillar with PBO | |
| 6 | Cu/SnAg | Ni-free pillar with PBO |
| Leg | Passivation | Bump structure | Remarks |
|---|---|---|---|
| 1 | PI | Ni/SnAg | Standard solder bump |
| 2 | Cu/Ni/SnAg | Standard Cu pillar | |
| 3 | Cu/SnAg | Ni-free pillar | |
| 4 | PBO | Ni/SnAg | Plated solder bump with PBO |
| 5 | Cu/Ni/SnAg | Cu pillar with PBO | |
| 6 | Cu/SnAg | Ni-free pillar with PBO |
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