Figure 5
The photograph shows two square electronic components placed side by side on a plain background. On the left, a flat square chip package is shown with a smooth surface, and white printed text reads “Texas Instruments”, accompanied by the Texas Instruments logo positioned to the left of the text. The edges of the chip are straight and uniform, forming a thin square profile. On the right, a similar square chip package is shown from the opposite side, revealing a dense grid of evenly spaced spherical solder balls arranged across the entire surface. The solder balls are uniform in size and aligned in rows and columns, covering the square area except for narrow margins near the edges. The two components are aligned horizontally, with the top surface view on the left and the ball grid array underside view on the right.Radar-on-chip IWR 1642 – Texas instruments. Source: https://www.ti.com/product/IWR1642