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Volume 43, Issue 4
1 April 1996
Anti-Corrosion Methods and Materials Cover Image for Volume 43, Issue 4
Editors
Yu Yan
Yu Yan
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Review Article| April 01 1996

Electropolishing of copper plates in water‐acetone mixtures

M. El‐Batouti
M. El‐Batouti
Chemistry Department, Faculty of Science, Alexandria University, Egypt.
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-4221
Print ISSN: 0003-5599
© MCB UP Limited
1996
Anti-Corrosion Methods and Materials (1996) 43 (4): 27–33.
https://doi.org/10.1108/eb007398

Reports on the determination of rates of electropolishing of copper by measuring the limiting current of anodic dissolution of copper in phosphoric acid and in (water‐acetone) ‐phosphoric acid mixtures. Notes that the rate of electropolishing is decreased in (water‐acetone) ‐phosphoric acid mixtures and that the percentage inhibition of dissolution depends on the mole fraction of acetone, and its dielectric constant. Concludes with calculation of the thermodynamic parameters of activation.

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© MCB UP Limited
1996
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