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The choice of electrodeposited silver solely because of its corrosion resistance is infrequent since a thick deposit to overcome porosity is necessary. Nevertheless, its anti‐corrosive properties are important in the very many applications in which it is used where this is not the first consideration. This article discusses modern techniques in plating which result in quicker plating times for a given thickness and describes methods for the reduction of tarnish. Trends and developments are reviewed.
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© MCB UP Limited
1963
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