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Volume 67, Issue 5
1 May 1995
This article was originally published in
Aircraft Engineering
Aircraft Engineering Cover Image for Volume 67, Issue 5
Review Article| May 01 1995

Materials

Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 2059-9366
Print ISSN: 0002-2667
© MCB UP Limited
1995
Aircraft Engineering (1995) 67 (5): 38–40.
https://doi.org/10.1108/eb037605

3M reports that it has developed a material which adds electromagnetic compatibility (EMC)‐shielding in a one‐step, thermoforming operation, eliminating the need for a second, costly and time‐consuming EMC shield‐adding process.

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© MCB UP Limited
1995
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Modeling and simulation analysis of an airship’s leveling process during non-forming ascent

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