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THE reliability of ICs and other semi‐conductors is a subject which continues to challenge both manufacturers and users. “High specification” markets such as the Avionics Sector, lead the user demand for a greater degree of assurance that the products they install demonstrate a longer and more effective life. The percentage of DOA (dead on arrival) components has become less but, nevertheless, Burn‐in of standard devices, or even re‐screening of those supplied as “high rel”, remain important activities in the manufacture of electronic assemblies — and a benefit to the user of the final product. Early failures, also known as “infant mortalities” and the concern for extended life in components, creates an element of worry in the minds of those companies whose products are required to provide high MBTFs, extended operational life and minimum risk of failure.

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