The goal is to manage the key value‐added processes from the “suppliers' supplier to the customers' customer.” Such end‐to‐end supply chain integration is very rare; however, many companies actively strive to implement initiatives in the areas of new product development, cycle time reduction, process redesign, cost minimization, and quality improvement across organizational boundaries. Most efforts are dyadic, focusing on a buyer/supplier relationship. Few examples of multi‐tier implementation efforts have been documented. This paper looks at the challenges encountered in the implementation of a quality initiative in the semiconductor industry. The focus is on the challenges encountered as a successful first‐tier implementation was driven back to the second tier. Initial efforts failed and responsibility for second‐tier implementation was passed back to the first‐tier suppliers. Efforts at this level continued to stall because the leverage dynamics of the supply chain was very different as smaller, second‐tier suppliers were engaged and encouraged to adopt the new quality standard.
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1 April 2004
Review Article|
April 01 2004
Benchmarking challenges to supply‐chain integration: Managing quality upstream in the semiconductor industry
Jason Briscoe;
Jason Briscoe
Intel Corporation, Chandler, Arizona, USA
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Terry Nels Lee;
Terry Nels Lee
Intel Corporation, Chandler, Arizona, USA
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Stanley E. Fawcett
Stanley E. Fawcett
Department of Management, Marriott School of Management, Brigham Young University, Provo, Utah, USA
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Publisher: Emerald Publishing
Online ISSN: 1758-4094
Print ISSN: 1463-5771
© Emerald Group Publishing Limited
2004
Benchmarking: An International Journal (2004) 11 (2): 143–155.
Citation
Briscoe J, Nels Lee T, Fawcett SE (2004), "Benchmarking challenges to supply‐chain integration: Managing quality upstream in the semiconductor industry". Benchmarking: An International Journal, Vol. 11 No. 2 pp. 143–155, doi: https://doi.org/10.1108/14635770410532589
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