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Purpose
The purpose of this paper is to obtain a multidisciplinary characterization of nanostructured copper films for electromagnetic shields.
Design/methodology/approach
Structural and electrical analysis have been applied, on copper nanometric films produced by a magnetron sputtering device.
Findings
Data are provided for copper films realized by magnetron sputtering deposition on glass, in different operating conditions.
Practical implications
A multidisciplinary comprehension of shielding effectiveness of nanostructured thin films can be important in many applications where there are electromagnetic compatibility problems.
Originality/value
The paper gives a valuable set of information for the characterization of nanometric copper thin films.
© Emerald Group Publishing Limited
2012
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