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Keywords: Thermal homogenization method
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Journal Articles
COMPEL (2024) 43 (2): 318–338.
Published: 01 April 2024
... resistance Coil winding technology Thermal homogenization method Packing factor where subscripts c, v, and f are used for conductor, varnish and filling insulator, respectively. The cross-sectional area of the conductor, varnish and filling insulator in each...
