Awards for Excellence
Awards for Excellence
Mark LefebvreShipley Company, Narlboro, MA, USAGeorge AllardyceShipley Europe Ltd, Coventry, UKMasaru SeitaShipley Far East Ltd, Omiya, JapanHideki TsuchidaShipley Far East Ltd, Omiya, JapanMasaru KusakaShipley Far East Ltd, Omiya, JapanandShinjiro HayashiShipley Far East Ltd, Omiya, Japan
are the recipients of the Journal's Outstanding Paper Award for Excellence for their paper
“Copper electroplating technology for microvia filling”
which appeared in Circuit World, Vol. 29 No. 2, 2003
Mark Lefebvre is a Research Manager with Rohm and Haas Electronic Materials, based in Marlborough, MA, USA and currently oversees global development of electroplating processes for Circuit Board Technologies. Mr Lefebvre received his BSc degree in Chemical Engineering from University of Massachusetts, Lowell, MA. He has over 20 years of industry experience, 14 of these with Rohm and Haas, with a focus on research and development of printed circuit board and microelectronics metallisation technologies.
George Allardyce is New Platforms Technology Manager with Rohm and Haas Electronic Materials based in Coventry, United Kingdom. He received Graduateship of the Royal Institute of Chemistry at Paisley University,Scotland, UK and is currently a Chartered Chemist and Member of the Royal Society of Chemistry. He has been involved in printed circuit board (PCB)technology for the past 24 years, 16 of these with Rohm and Haas. During this time he has held various positions in both fabrication and chemical process supply aspects of the industry. His current role focuses on research and product development of metallisation technologies for circuit fabrication. He has previously published and presented papers on PCB topics and holds several patents in this field.
Masaru Seita was a Research Manager with Rohm and Haas Electronic materials based in Omiya, Saitama-City until his departure in October 2003. Prior to leaving Dr Seita led a group responsible for research and development of new products for PCB fabrication. Dr Seita received his degree of Doctor in Engineering from Kinki University, Higashi- osaka, Osaka. He has 24 years industry experience, and his research interests include electroplating,electroless plating and related technology primarily for electronics industry applications. Dr Seita has published over ten papers on the formation of conductive films on resins and holds several patents in this field.
Hideki Tsuchida is a Research Assistant Manager with Rohm and Haas Electronic Materials based in Omiya, Saitama-City, Japan and is a specialist in the field acid copper electroplating. Tsuchida-san received his Bachelor of Engineering degree in Chemical Engineering from the University of Toyo, Saitama,Japan. He has worked with Rohm and Haas for 17 years in research, development and process engineering of metallisation technologies for PCB fabrication.
Masaru Kusaka is a Research Chemist with Rohm and Haas Electronic Materials based in Omiya, Saitama-City, Japan and is a member of the Circuit Board Technologies global development team for electroplating processes. Kusaka-san graduated from the University of Konan, Kobe, Japan with a Bachelor of Engineering degree in Applied Chemistry. He has over 9 years of industry experience, all of these with Rohm and Haas and has been engaged in research,development and process engineering of metallisation technologies for PCB fabrication.
Shinjiro Hayashi is a Research Chemist with Rohm and Haas Electronic Materials based in Omiya, Saitama-City, Japan and is a member of the Circuit Board Technologies global development team for electroplating processes. Hayashi-san received his Bachelor of Engineering degree in Industrial Chemistry from the University of Kanto Gakuin, Yokohama, Japan. He has over 8 years of industry experience with Rohm and Haas and has been engaged in research,development and process engineering of metallisation technologies for PCB fabrication.
