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Volume 10, Issue 3
1 February 1984
Circuit World Cover Image for Volume 10, Issue 3
Review Article| February 01 1984

Tape Automated Bonding and its Impact on the PWB

Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1984
Circuit World (1984) 10 (3): 26–29.
https://doi.org/10.1108/eb043725

This paper briefly reviews the impact that tape automated bonding systems are having in the semiconductor industry and describes a recent development of a bumped testable TAB system suitable for direct assembly to PWBs. The impact that such a system will have on PWB technology is discussed.

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© MCB UP Limited
1984
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