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Volume 11, Issue 2
1 January 1985
Circuit World Cover Image for Volume 11, Issue 2
Review Article| January 01 1985

Non‐conventional Substrates Available to Purchase

G. Messner
G. Messner
PCK Technology Division, Kollmorgen Corporation, New York, USA
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1985
Circuit World (1985) 11 (2): 39–41.
https://doi.org/10.1108/eb045990

This paper describes recent printed board applications in circuit manufacturing on novel non‐laminate substrates. It specifically discusses properties pertinent to metal core, thermal plastics, and new processing conditions for circuitising the new substrates. Techniques explored are intended to provide rigidity, flatness, dimensional stability and improved thermal management.

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© MCB UP Limited
1985
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