Electroplating Copper for Printed Circuit Manufacture

In through‐hole plated double‐sided and multilayer printed circuit boards, electroplated copper forms the main electrically conductive path on hole walls. To ensure high reliability of electrical connection during component assembly, soldering and subsequent service, the properties of process solutions and deposits must be controlled. This paper discusses the methods of measuring and controlling copper plating processing parameters to achieve the optimum deposit properties. Plating pre‐treatment is discussed also as this can influence significantly process performance.