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During the past several years, technical requirements of the printed circuit board industry have increased greatly, due to the need for greater processing latitude, higher density devices and higher reliability in the finished parts. This need has resulted, in many cases, in the emergence and/or recognition of numerous problem areas which have created greater demands on the desmear and PTH processes, specifically. Problems such as hole‐wall pullaway, resin recession, blistering, gross voiding, and blow holes have grown in importance and severity as a result of today's needs. The development of a reliable and practical permanganate desmear process has proven to solve numerous of these technical problems. The characteristics, operation, and advantages of this three‐step permanganate process will be discussed in some detail, with particular emphasis on demonstrated improvement in PCB production results.

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