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Volume 13, Issue 4
1 March 1987
Circuit World Cover Image for Volume 13, Issue 4
Review Article| March 01 1987

The Impact of Metal Cored Multilayer Boards for Surface Mounted Devices

G.C. Wilson
G.C. Wilson
Ferranti Computer Systems Ltd, Bracknell, Berkshire, England
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1987
Circuit World (1987) 13 (4): 16–18.
https://doi.org/10.1108/eb043894

The new generation of SMDs (LCCs) can now be mounted on multilayer printed circuits which offer a thermal expansion similar to that of ceramic. In addition, a thermal management solution is available as a means of removing heat generated by the devices. This paper discusses the new development in multilayer board design construction and component assembly associated with metal core boards. New methods of selective plating component footprints are also discussed.

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© MCB UP Limited
1987
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