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Volume 13, Issue 4
1 March 1987
Circuit World Cover Image for Volume 13, Issue 4
Review Article| March 01 1987

Three‐dimensional Circuitisation of Plastic Mouldings

B.J. Stevens
B.J. Stevens
General Hybrid Ltd, Jarrow, Tyne and Wear, England
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1987
Circuit World (1987) 13 (4): 24–25.
https://doi.org/10.1108/eb043898

This paper briefly discusses various solutions to 3‐D PCBs by giving an overview of available technologies. Specific attention is then directed to the author's company's technique. Coverage of aspects such as: Potential Market Size and Relationship to Existing Technologies, Functional Specification, Test Results, and Low Tool Costs is given.

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© MCB UP Limited
1987
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