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Volume 13, Issue 4
1 March 1987
Circuit World Cover Image for Volume 13, Issue 4
Review Article| March 01 1987

Theoretical Considerations on the Thermal Expansion of Copper‐Invar‐Copper Metalcore Boards for Surface Mounting Technology Available to Purchase

K. Ritz
K. Ritz
Schoeller Elektronik, Wetter (Hessen), Germany
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1987
Circuit World (1987) 13 (4): 7–9.
https://doi.org/10.1108/eb043888

A model for a symmetric three‐layer configuration is developed. This model refers to Cu/Invar/Cu (CIC) laminates. Calculated values for the coefficient of thermal expansion (CTE) are compared with literature values. The model is then extended to symmetric CIC‐Metalcore boards and its prediction is compared with experimental results. Shearing of FR‐4 is discussed.

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© MCB UP Limited
1987
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