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Multilayer boards for high‐speed digital applications are no longer solely substrates for the electrical interconnections needed but play an active role regarding the overall performance of electronic assemblies. In the general part of this paper all the important parameters regarding achievable impedances and their tolerances are discussed in detail. The second part is concerned with the practical realisation of Microwave Theory on a selected example of a high‐speed MLB.
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© MCB UP Limited
1987
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