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Nicolet Test Instruments have announced the release of the new PA‐120 Best Fit Drill system. This product incorporates the technology of a precision automated X‐ray imaging system with a computer vision system designed to optimise the accuracy of the drill placement process in the manufacture of multilayer circuit boards. Answers provided by testing with the PA‐120 permit compensation for accumulated production process errors by measuring inner‐layer shifts and optimise drill hole placement by calculating best‐fit offsets. What this means to manufacturers is maximised yields for multilayer board products by giving the opportunity to compensate for lamination errors.
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