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The electronics industry is now expanding at a considerable rate, but not so the board geometry. Track sizes are generally still at 0·010 in. but even this size puts considerable strain on the repair operations. The move to surface mount technology also has the effect of reducing track sizes. The quality of repair which may be produced by conventional methods can not rival the visual quality which may be obtained by parallel gap welding. This paper will examine in a practical way the process and methods which can be employed to save valuable material.
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© MCB UP Limited
1988
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