New Products Available to Purchase

A new development in palladium‐nickel processes is available from Engelhard. ‘Pallnic’ II is an improvement on the established market leader ‘Pallnic’ which was designed to function as a substitute for acid hard gold deposits used in connectors, printed circuits and other electronic components. ‘Pallnic’ II uses a novel palladium complex to improve the deposit and electrolyte properties even further, which makes it a very realistic and cost‐effective alternative to gold plating. Two processes are available.