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Volume 15, Issue 2
1 January 1989
Circuit World Cover Image for Volume 15, Issue 2
Review Article| January 01 1989

PCB Vacuum Bonding Autoclave—Vacuum Bagging Techniques

Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1989
Circuit World (1989) 15 (2): 36.
https://doi.org/10.1108/eb043972

This paper describes the new technique used by International Computers Limited for vacuum bagging multilayer PCB bonding stacks. It is used as a cost‐effective alternative to previous consumable bagging systems used in autoclave vacuum bonding.

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© MCB UP Limited
1989
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