A Practical Solution for Low‐cost, High Performance MCMs

An IC manufacturer's experience with a new technology for connecting bare chips to flexible PCBs is described. The process produces low‐cost fine line flexible PCBs and also direct chip to PCB connection as an integral step in PCB production. The paper is addressed to managers and technologists involved in MCM or bare chip packaging development and fabrication. The technology described was developed by AMEG in conjunction with a number of specialist companies and presents an approach of strategic significance to the industry. IC (integrated circuit) packaging technology is a priority issue, as systems' performance is no longer silicon driven, but is now determined by the interconnection systems used between ICs. This problem is not new, but is rapidly escalating. There is an abundance of technical offerings addressing this question. However, those capable of acceptable performance are distinguished by their high level of both complexity and cost. Of greater consequence is their inability to be effectively implemented in the ‘real world’. One IC house has identified this as a key strategic issue. It accepts that a solution must also make managerial sense, consider the logistics issues, be cost‐effective and enable a practical implementation strategy. The results of this development are the subject of this paper. Despite its divergent development terms of reference, technical performance is not compromised.