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Volume 21, Issue 2
1 February 1995
Circuit World Cover Image for Volume 21, Issue 2
Review Article| February 01 1995

Fluxless Wave Soldering Available to Purchase

D.M. Tench;
D.M. Tench
Rockwell International Science Center, Thousand Oaks, California, USA
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J.T. White;
J.T. White
Rockwell International Science Center, Thousand Oaks, California, USA
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D. Hillman;
D. Hillman
Collins Avionics and Communications Division, Rockwell International, Cedar Rapids, Iowa, USA
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G.K. Lucey;
G.K. Lucey
Army Research Laboratories, Adelphi, Maryland, USA
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T. Gher;
T. Gher
Army Research Laboratories, Adelphi, Maryland, USA
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B. Piekarski
B. Piekarski
Army Research Laboratories, Adelphi, Maryland, USA
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1995
Circuit World (1995) 21 (2): 44–45.
https://doi.org/10.1108/eb046303

Fluxless wave soldering in a nitrogen atmosphere was investigated for epoxy‐fibreglass circuit board coupons having bare copper and solder‐coated through‐holes. The Reduced Oxide Soldering Activation (ROSA™) pretreatment was found to consistently provide good hole filling and through‐hole solder joints of excellent appearance. For preheated coupons, low levels of residual oxygen and short exposure to air after the ROSA treatment were found to have no effect

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© MCB UP Limited
1995
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