The strain‐based flex fatigue of 18 μm thick copper foil is evaluated over a wide range of strain amplitudes. Seven electrodeposited foils, four commercial grades and three experimental foils, and a commercial grade rolled foil are characterized. The fatigue life versus cyclic strain amplitude curve in the high strain amplitude (low cycle) and low strain amplitude (high cycle) regimes is developed for each foil. On the basis of fatigue life (Nf) and fatigue ductility (Df), the low cycle fatigue performance of eight foils is ranked. Universal correlations of Nf and Df with the uniaxial tensile strength are established. Two electrodeposited foils, experimental foil DF 8 in the high strain amplitude regime and commercial foil DF 9 in the low strain amplitude regime, have been shown to display fatigue performance comparable to that of the commercial rolled GR 8 foil.
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1 March 1999
Review Article|
March 01 1999
18 μm electrodeposited copper foil for flex fatigue applications
Harish D. Merchant;
Harish D. Merchant
Gould Electronics, Eastlake, Ohio, US
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Melvin G. Minor, Jr;
Melvin G. Minor, Jr
Gould Electronics, Eastlake, Ohio, US
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Sid J. Clouser;
Sid J. Clouser
Gould Electronics, Eastlake, Ohio, US
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Dan T. Leonard
Dan T. Leonard
Gould Electronics, Eastlake, Ohio, USA
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Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1999
Circuit World (1999) 25 (1): 38–46.
Citation
Merchant HD, Minor MG, Clouser SJ, Leonard DT (1999), "18 μm electrodeposited copper foil for flex fatigue applications". Circuit World, Vol. 25 No. 1 pp. 38–46, doi: https://doi.org/10.1108/03056129910244842
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