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Volume 25, Issue 2
1 June 1999
Circuit World Cover Image for Volume 25, Issue 2
Technical Paper| June 01 1999

Limits of copper plating in high aspect ratio microvias

;
Steve Castaldi
MacDermid, Inc., Waterbury, Connecticut, USA
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Dennis Fritz
MacDermid, Inc., Waterbury, Connecticut, USA
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Ron Schaeffer
PhotoMachining, Inc., Pelham, New Hampshire, USA
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© Company
1999
Circuit World (1999) 25 (2): 35–40.
https://doi.org/10.1108/03056129910258324

This paper explores the capability of electroless copper deposition plus acid copper electroplating to metallize high aspect ratio microvias.

Keywords: Copper, Microvias, Plating, Printed circuit boards
© Company
1999
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