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Volume 25, Issue 3
1 September 1999
Circuit World Cover Image for Volume 25, Issue 3
Technical Paper| September 01 1999

Conductive filament formation failure in a printed circuit board Available to Purchase

Keith Rogers;
Keith Rogers
CALCE Electronic Products and Systems Consortium, University of Maryland, USA
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Craig Hillman;
Craig Hillman
CALCE Electronic Products and Systems Consortium, University of Maryland, USA
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Michael Pecht;
Michael Pecht
CALCE Electronic Products and Systems Consortium, University of Maryland, USA and
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Suzanne Nachbor
Suzanne Nachbor
Honeywell Inc., Minneapolis, USA
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1999
Circuit World (1999) 25 (3): 6–8.
https://doi.org/10.1108/03056129910268882

A defective printed circuit board assembly that exhibited excessive current leakage was examined to determine the responsible failure mechanisms. Observation of the failure site (determined electrically) by optical and electron microscopy revealed an area in the circuit board where debonded fiber bundles bridged a plated‐through‐hole (PTH) to a copper plane. This phenomenon is highly suggestive of conductive filament formation.

Keywords:
Conductive filaments, Printed circuit boards, Surface leakage current
© MCB UP Limited
1999
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