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Volume 3, Issue 1
1 April 1976
Circuit World Cover Image for Volume 3, Issue 1
Review Article| April 01 1976

Gold Plating of Printed Circuit Boards and Wire: Plating Techniques for Ultrasonic Bonding Available to Purchase

Leo Missel
Leo Missel
International Business Machines Corp., General Products Div., San Jose, California, U.S.A.
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1976
Circuit World (1976) 3 (1): 17–23.
https://doi.org/10.1108/eb043544

In this paper, reproduced by permission of “Metal Finishing” (New Jersey), the author enumerates the required properties of electroplated gold coatings on printed circuit boards and wire to ensure satisfactory bonding by ultrasonic means. The gold plating procedures and process control methods which are necessary to produce coatings yielding consistently high bond strengths are described.

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© MCB UP Limited
1976
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