This paper addresses materials and processes for printed wiring board compatible embedded capacitors using polymer/ceramic nanocomposites and hydrothermal barium titanate. Polymers allow low temperature fabrication appropriate to the board (MCM‐L) technology. The lower dielectric constants of the commercially available polymers can be greatly compensated by incorporating higher permittivity ceramic fillers. Materials requirements for higher capacitance density (>30 nF/cm2) have been addressed through implementation of a novel low‐temperature processable hydrothermal barium titanate film on a patterned titanium foil laminated to the PWB. Application of hydrothermal grown barium titanate is currently being evaluated using a multi‐layer system‐on‐package demonstration.
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1 March 2004
Research Article|
March 01 2004
Process development for PWB compatible embedded capacitors
Swapan K. Bhattacharya;
Swapan K. Bhattacharya
School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA
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P. Markondeya Raj;
P. Markondeya Raj
School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA
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Devarajan Balaraman;
Devarajan Balaraman
School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA
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Hitesh Windlass;
Hitesh Windlass
School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA
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Rao R. Tummala
Rao R. Tummala
School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA
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Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© Emerald Group Publishing Limited
2004
Circuit World (2004) 30 (1): 31–35.
Citation
Bhattacharya SK, Markondeya Raj P, Balaraman D, Windlass H, Tummala RR (2004), "Process development for PWB compatible embedded capacitors". Circuit World, Vol. 30 No. 1 pp. 31–35, doi: https://doi.org/10.1108/03056120410496360
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