Embedded passives technologies can provide benefits of size, performance, cost, and reliability to high density, high‐speed designs. A number of embedded passive technology solutions are available to the designer. Based on our experience with Rohm and Haas's thin‐film, high‐ohmic, InSiteTM embedded resistor materials (500 and 1000 Ω/sq), this paper provides some guidelines for selecting the appropriate embedded resistor technology and implementing it at a board fabricator. The design of embedded resistors, and the trade‐offs between resistor size, tolerance, and capability of board fabrication processes, are analyzed in detail. This paper also discusses selection of the appropriate embedded capacitor technology and introduces some initial results on Rohm and Haas's thin‐film, high‐Dk, InSite embedded capacitor material (200 nF/cm2).
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1 March 2005
Conceptual Paper|
March 01 2005
Design considerations for thin‐film embedded resistor and capacitor technologies Available to Purchase
Percy Chinoy;
Percy Chinoy
Rohm and Haas Electronic Materials LLC, Marlborough, Massachusetts, USA
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Marc Langlois;
Marc Langlois
Rohm and Haas Electronic Materials LLC, Norcross, Georgia, USA
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Raj Hariharan;
Raj Hariharan
Rohm and Haas Electronic Materials LLC, Norcross, Georgia, USA
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Mike Nelson;
Mike Nelson
Rohm and Haas Electronic Materials LLC, Norcross, Georgia, USA
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Anthony Cox;
Anthony Cox
Rohm and Haas Electronic Materials LLC, Norcross, Georgia, USA
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Tony Ridler
Tony Ridler
Rohm and Haas Electronic Materials Europe Ltd, Coventry, UK
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Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© Emerald Group Publishing Limited
2005
Circuit World (2005) 31 (1): 21–27.
Citation
Chinoy P, Langlois M, Hariharan R, Nelson M, Cox A, Ridler T (2005), "Design considerations for thin‐film embedded resistor and capacitor technologies". Circuit World, Vol. 31 No. 1 pp. 21–27, doi: https://doi.org/10.1108/03056120510553194
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