There are many considerations that have to be taken into account when balancing the properties epoxy‐based laminate and prepreg materials must have in order to meet the array of electrical, thermal and mechanical demands of today's multilayer printed circuit boards. Aims to discuss two different curing systems that are commonly employed in current laminate and prepreg materials.
An examination of the two different curing systems – phenol novolac (PN) and dicyandiamide (DICY) based – that are commonly employed in current laminate and prepreg materials.
DICY curing systems have properties such as good flexibility, good adhesion and good processability but have poor thermal resistance, higher water absorption and poor anti‐CAF capability. Because PN resin systems utilize an aromatic ring structure, traditional PN cured epoxy resin results in having excellent thermal resistance, low water absorption and anti‐CAF capability.
Provides a comparison of interest to all those involved with laminate and prepreg materials in the circuit board industry.
