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Purpose
The failure analysis of electronic components and interconnection systems such as integrated circuits, printed circuit board assemblies, and hybrid devices is discussed.
Design/methodology/approach
How the analytical techniques used for physical and chemical analysis, which include X‐ray radiography, optical microscopy and scanning electron microscopy/energy dispersive X‐ray spectroscopy, are used.
Findings
Examples from recent case studies are given to illustrate the work.
Originality/value
The paper demonstrates how the failure analysis of an electronic component or interconnection system is conducted, and what can be learnt from the investigation.
© Emerald Group Publishing Limited
2007
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