The purpose of this paper is to give an overview of the benefits and challenges of different technologies for via replacement in the realization of flexible substrates with more than one layer.
The paper details the use of traditional technology for via formation and discusses the placement of jumpers (0 Ω resistors) and polymer thick film printing as alternative methods.
The paper covers a selection of possible techniques for replacement of vias. The results demonstrate the capability of polymer thick film pastes on flexible substrates. Depending on the requirements of the application and the operating environment, use of other substrate materials opens up a large variety of possible solutions.
The paper details the different techniques for via replacement and gives information about the different technological approaches.
