Cumulative degradation methodology to predict reliability of electronic systems

George Thiel holds MS and PhD degrees in Theoretical and Applied Mechanics from the University of Illinois at Urbana-Champaign. He currently works in the hardware reliability group at Microsoft where he has worked as lead system reliability engineer and touch-display reliability engineer. He also leads a team of finite element analysts. Before joining Microsoft, Dr Thiel worked at Lockheed Martin and IBM. Outside of the commercial and microelectronics industry, he has used his knowledge of mechanics to aid in the design of arterial stents and unmanned aerial vehicles. Dr Thiel was an adjunct professor at Binghamton University teaching courses in finite element analysis, elasticity and plasticity; he has coauthored nine papers and holds 15 US patents.

Flavio Griggio works at Microsoft in the Azure organization. He is responsible for process technology integration of cloud infrastructure. At Microsoft he has previously held the role of reliability engineer, and he was responsible for the qualification of touch display modules in Microsoft devices. Before Microsoft he held roles of process integration engineer and reliability engineer at Intel where he developed methods to scale copper integration for the 10 and 7 nm technology nodes and was responsible for qualifying cobalt as a local interconnect metal for the 10 nm node. He holds eight patents and one paper on the topic of interconnect scaling. Dr Griggio received his BS and MS degree in Materials Science and Engineering from the University of Padova, Italy (2007) and his PhD degree in Materials Science and Engineering from the Pennsylvania State University (2011). He authored 18 papers and 2 book chapters on the topics of piezoelectric MEMS, silicon reliability and system reliability. He is a member of IEEE and is the chair for the System Electronics Reliability track for the 2021 International Reliability Physics Symposium.

Sanjay Tiku currently works at Microsoft in their Devices group. He is responsible for reliability and qualification of hardware products. He is accountable for development of design concepts for complex electromechanical products and creation of reliability specifications for them. He leads a team of engineers and researchers who use advanced computer aided design analysis tools, experimental techniques and other numerical and statistical methods to ensure and advance Hardware’s leadership position in exceeding consumers’ durability expectations. Previously, he has worked at the Research Center of Tata Motors and also taught mechanical engineering for a while in India. Dr Tiku holds MS and PhD degrees in Mechanical Engineering from the University of Maryland, College Park. His doctoral research was focused on quality and reliability of electronic products and electronic parts selection and management. He has written several papers and book chapters in this area. He is a member of the IEEE and the academic honor society Phi Kappa Phi.