New Non‐Precious Metal Catalyst for Through‐Hole Plating

Until recently the majority of catalysts used in through‐hole plating of printed circuits have been based on processes containing tin and palladium. These have been adequate although, with the ever increasing demands on quality of subsequently assembled printed circuits, they have shortcomings which are functions of the basic formulae and mechanisms of operation. The new non‐precious metal catalyst based on copper operates over a much wider range of conditions and, unlike palladium catalysts, promotes complete coverage of epoxy glass laminates. The operation of both catalyst systems is discussed in depth and compared, significant emphasis being placed on the mechanism of surface activation.