Substrates for Surface Mounted Components

A dramatic growth‐rate is envisaged in the next decade in the demands on the integrated circuit industry, posing the question of the necessity for new techniques. Present technology does not lend itself to continued linear extension, and new semiconductor package types of increasing complexity require purpose designed interconnection systems. Tape Automated Bonding and Leadless Chip Carriers are currently becoming fairly widely used alternatives, while emphasis is being placed on developing the surface attachment concept. Potential problem areas centre around the cost of interconnections, which is closely dependent on their density; the heat dissipation properties of substrates encountering considerable heat generation from complex circuits; flexibility of design, and faster design time and delivery requirements. However, printed circuit technology is assured a healthy future provided that adjustments are made and experiments undertaken, such as those involving thick film hybrid technology, the use of porcelainised steel substrates, and the Lampac, Pactel and Microwire techniques for high density interconnection systems supported on metal planes.