Polysulphone Circuitry for High Frequency Applications

In attempts to meet the need for low‐loss materials capable of attaining the dielectric properties that are required for rapidly developing microwave and high speed digital equipment, polysulphone in its various forms has been undergoing investigation. Microwave dielectric properties are examined with respect to temperature and frequency, and three types of polysulphone are studied in depth, with testing for dielectric constant and dissipation factor. The material's physical properties are listed prior to advisory comments on special processing requirements. Its feasibility in multilayer production is currently being researched.