IPC. IPC releases 'F' revision of IPC-A-600
IPC
IPC releases "F" revision of IPC-A-600
Keywords: IPC, Standards, Printed circuit boards
IPC has announced the release of the latest revision for the IPC-A-600,Acceptability of Printed Boards. The most-widely used board acceptability standard in the printed wiring board industry, IPC-A-600F incorporates a number of changes to address the technological advancements made in the industry since the release of the "E" revision in August 1995.
IPC-A-600F provides PWB fabricators, board inspectors and quality assurance personnel with the best PWB defect detection and prevention information available. It gives updated information on annular ring requirements and plating voids for plated through-holes, and expands coverage of flexible and rigid-flex printed wiring acceptance criteria; board flatness requirements; resin fill for buried and blind vias; and foil thickness requirements for conductive patterns.
The document also presents new coverage on subsurface conditions, such as measling and crazing. "The lack of failure data for measling and crazing among all known military and industry testing data necessitated an alteration in the requirements for base material anomalies," says John Perry, IPC project manager.
In addition, IPC-A-600 relies heavily on both design and end product requirements for printed boards - established in IPC-2221 and IPC-6012, which have both undergone extensive revisions. Perry says the "F" revision resolves conflicts with these documents. For more information on IPC-A-600F, contact John Perry at +1 (847) 790-5318; JohnPerry@ipc.org,or visit the IPC Web site at www.ipc.org
