Build-up technology in Japan

Build-up technology in Japan

Keywords Publication, Japan, Build-up technology

A new market survey on build-up technologies in Japan has just been released by Japan Marketing Survey Co. Ltd.

Title: Market & Technology Analysis of the Build-up PCB in Japan 2000Date of issue: 1 August, 2000Number of pages: 150 pages, A4 sizePrice: US$1800, plus postage US$50Additional copy: US$100Additional CD-ROM: US$100

The survey covers the following topic areas:

• 1.

  Japan's build-up substrate market scale classified by process (on a volume basis/a value basis).

• 2.

  23 Japanese companies' sales performance of build-up substrates, classified by process.

• 3.

  Forecasts of build-up substrate market scale classified by process(2000-2005).

• 4.

  Market scale classified by final product (in 1999 and 2000) and analysis of most likely build-up substrate application markets (ex. MPU package substrates,Note PCs, cellular phones).

• 5.

  Technical comments on Japan's build-up substrates.

• 6.

  Trends in choosing material (dielectric resin) and adopting situation.

• 7.

  Trends in license supply relationships.

• 8.

  Profile of leading build-up substrate makers in Japan.

For further information, Tel: +81 3 5641 2871; Fax: +81 3 5641 0529; E-mail: m-norie@jms21.co.jp