Electronic Circuits World Convention
Electronic Circuits World Convention7-9 October 2002
Keywords: Electronics, Meetings
ECWC9 and EPC2002 are the most important events in the European printed circuit/ interconnection industry calendar for the year 2002, and is supported by the World Electronic Circuits Council (WECC) as one of the leading international events, amongst others, like IPC Expo and JPCA.
The purpose of the Electronic Circuits World Convention is to provide a forum for the interchange of Technical and Management concepts used on a worldwide basis. ECWC9 will focus on the latest research and the new-future innovation on interconnection, packaging, and assembly of electronic and opto-electronic circuits. Delegates and visitors from throughout the world will attend this event, offering presenters the opportunity to reach a wide audience of decision makers and leaders of the international packaging and interconnection industry.
On February 4 and 5 the Programme Committee of ECWC9 met in order to prepare the provisional programme of the world conference. Out of 180 abstracts that were sent in to all participating associations the committee chose 75 papers that will be presented at the conference.
The conference papers will be divided into three main tracks: Management,Materials and Processes.
Management sessions include papers on:
Environmental considerations
Electronic packaging design
Regional market development
Future printed circuit technologies
Management software tools
Understanding market demand
Management strategies
Business & manufacturing efficiencies
Global market conditions
Materials sessions include papers on:
Dielectric construction solutions
High performance laminate materials
Embedded component technology
Embedded component materials
Advanced dielectric materials
Solder selection methodologies
Conductive properties of metals
Assembly technology decisions
Semiconductor packaging impacts
Process sessions will include papers on:
Leading edge printed board technologies
Future imaging processes
Signal integrity characterization
Advanced plating processes
Via hole technology challenges
High density interconnects
Multilayer implementation
Multilayer registration
Automatic optical inspection trends
For further information, or an up to date list of papers, please visit: www.eipc.org
